Ultra-high-density interconnection technology of three-dimensional packaging.
Kenji TakahashiMitsuo UmemotoNaotaka TanakaKazumasa TanidaYoshihiko NemotoYoshihiro TomitaMasamoto TagoManabu BonkoharaPublished in: Microelectron. Reliab. (2003)
Keyphrases
- high density
- three dimensional
- low density
- data center
- close proximity
- magnetic recording
- high power
- high speed
- cost effective
- field effect transistors
- thin film
- data processing
- high bandwidth
- database
- d objects
- neural network
- multi view
- magnetic tape
- rapid development
- virtual reality
- x ray
- image sequences
- key technologies
- case study
- metadata
- information systems