Khanh N. Dang

Publication Activity (10 Years)

Years Active: 2015-2024
Publications (10 Years): 35

Top Topics

Reliability Assessment

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Pham-Khoi Dong, Khanh N. Dang, Duy-Anh Nguyen, Xuan-Tu Tran
A light-weight neuromorphic controlling clock gating based multi-core cryptography platform. Microprocess. Microsystems 106 (2024)
Williams Yohanna Yerima, Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah
Fault-Tolerant Spiking Neural Network Mapping Algorithm and Architecture to 3D-NoC-Based Neuromorphic Systems. IEEE Access 11 (2023)
Khanh N. Dang, Nguyen Anh Vu Doan, Ngo-Doanh Nguyen, Abderazek Ben Abdallah
HeterGenMap: An Evolutionary Mapping Framework for Heterogeneous NoC-Based Neuromorphic Systems. IEEE Access 11 (2023)
Williams Yohanna Yerima, Khanh N. Dang, Abderazek Ben Abdallah
Fault Recovery in Spiking Neural Networks Through Target and Selection of Faulty Neurons for 3D Spiking Neuromorphic Processors. ICKII (2023)
Ngo-Doanh Nguyen, Akram Ben Ahmed, Abderazek Ben Abdallah, Khanh N. Dang
Power-Aware Neuromorphic Architecture With Partial Voltage Scaling 3-D Stacking Synaptic Memory. IEEE Trans. Very Large Scale Integr. Syst. 31 (12) (2023)
Williams Yohanna Yerima, Khanh N. Dang, Abderazek Ben Abdallah
R-MaS3N: Robust Mapping of Spiking Neural Networks to 3D-NoC-Based Neuromorphic Systems for Enhanced Reliability. IEEE Access 11 (2023)
Ngo-Doanh Nguyen, Khanh N. Dang
A Novel Yield Improvement Approach for 3D Stacking Neuromorphic Architecture. MCSoC (2023)
Zhishang Wang, Khanh N. Dang, Abderazek Ben Abdallah
Interlinked Chain Method for Blockchain-Based Collaborative Learning in Vehicular Networks. MCSoC (2023)
Ngo-Doanh Nguyen, Xuan-Tu Tran, Abderazek Ben Abdallah, Khanh N. Dang
An In-Situ Dynamic Quantization With 3D Stacking Synaptic Memory for Power-Aware Neuromorphic Architecture. IEEE Access 11 (2023)
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (4) (2022)
Tomohide Fukuchi, Ogbodo Mark Ikechukwu, Jiangkun Wang, Khanh N. Dang, Abderazek Ben Abdallah
Efficient Pneumonia Detection Method and Implementation in Chest X-ray Images Based on a Neuromorphic Spiking Neural Network. ICCCI (2022)
Khanh N. Dang, Nguyen Anh Vu Doan, Abderazek Ben Abdallah
MigSpike: A Migration Based Algorithms and Architecture for Scalable Robust Neuromorphic Systems. IEEE Trans. Emerg. Top. Comput. 10 (2) (2022)
Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, Francesca Iacopi
A low-power, high-accuracy with fully on-chip ternary weight hardware architecture for Deep Spiking Neural Networks. Microprocess. Microsystems 90 (2022)
Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah
Energy-Efficient Spike-Based Scalable Architecture for Next-Generation Cognitive AI Computing Systems. UNet (2021)
Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah
On the Design of a Fault-Tolerant Scalable Three Dimensional NoC-Based Digital Neuromorphic System With On-Chip Learning. IEEE Access 9 (2021)
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
Report on power, thermal and reliability prediction for 3D Networks-on-Chip. CoRR (2020)
Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah
Scalable Design Methodology and Online Algorithm for TSV-Cluster Defects Recovery in Highly Reliable 3D-NoC Systems. IEEE Trans. Emerg. Top. Comput. 8 (3) (2020)
Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip. IEEE Access 8 (2020)
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems. IEEE Access 8 (2020)
Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems. CoRR (2020)
Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, Francesca Iacopi
A lightweight Max-Pooling method and architecture for Deep Spiking Convolutional Neural Networks. APCCAS (2020)
Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah
Soft-Error and Hard-fault Tolerant Architecture and Routing Algorithm for Reliable 3D-NoC Systems. CoRR (2020)
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Trans. Very Large Scale Integr. Syst. 28 (3) (2020)
Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems. CoRR (2020)
Khanh N. Dang, Abderazek Ben Abdallah
An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. CoRR (2020)
Mark Ogbodo, The Vu, Khanh N. Dang, Abderazek Ben Abdallah
Light-Weight Spiking Neuron Processing Core for Large-Scale 3D-NoC Based Spiking Neural Network Processing Systems. BigComp (2020)
Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
TSV-IaS: Analytic Analysis and Low-Cost Non-Preemptive on-Line Detection and Correction Method for TSV Defects. ISVLSI (2019)
Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran
An on-Communication Multiple-TSV Defects Detection and Localization for Real-Time 3D-ICs. MCSoC (2019)
Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. APCCAS (2019)
Khanh N. Dang, Abderazek Ben Abdallah
An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. IINTEC (2019)
Khanh N. Dang, Xuan-Tu Tran
Parity-Based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication. MCSoC (2018)
Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah
A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model. IEEE Trans. Very Large Scale Integr. Syst. 25 (11) (2017)
Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems. J. Supercomput. 73 (6) (2017)
Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems. ATS (2016)
Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah
Soft-error resilient Network-on-Chip for safety-critical applications. ICICDT (2016)
Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, Xuan-Tu Tran
Soft-error resilient 3D Network-on-Chip router. iCAST (2015)