Report on power, thermal and reliability prediction for 3D Networks-on-Chip.
Khanh N. DangAkram Ben AhmedAbderazek Ben AbdallahXuan-Tu TranPublished in: CoRR (2020)
Keyphrases
- prediction accuracy
- ibm power processor
- low cost
- high speed
- air temperature
- high bandwidth
- social networks
- power consumption
- network structure
- neural network ensemble
- infrared
- network analysis
- neural network
- load forecasting
- multithreading
- analog vlsi
- complex networks
- prediction algorithm
- power system
- power dissipation
- chip design
- electrical power
- functional verification