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HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems.

Khanh N. DangAkram Ben AhmedAbderazek Ben AbdallahXuan-Tu Tran
Published in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2022)
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