Tsunaaki Shidei

Publication Activity (10 Years)

Years Active: 2011-2019
Publications (10 Years): 2

Top Topics

Error Correction

Fluoroscopic Images

Top Venues

IEEE J. Solid State Circuits

CANDAR Workshops

Publications

Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Tsunaaki Shidei, Hideharu Amano
Real Chip Performance Evaluation on Through Chip Interface IP for Renesas SOTB 65nm Process. CANDAR Workshops (2019)
Atsutake Kosuge, Junki Hashiba, Toru Kawajiri, So Hasegawa, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda, Ken Takeuchi
An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories. IEEE J. Solid State Circuits 51 (4) (2016)
Atsutake Kosuge, Junki Hashiba, Toru Kawajiri, So Hasegawa, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda, Ken Takeuchi
Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory. VLSIC (2015)
Atsutake Kosuge, Wataru Mizuhara, Tsunaaki Shidei, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda
A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler. IEEE J. Solid State Circuits 49 (1) (2014)
Wataru Mizuhara, Tsunaaki Shidei, Atsutake Kosuge, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda
A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler. ISSCC (2013)
Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda
Wireless Power Transmission for Non-contact Wafer-Level Testing. IEICE Trans. Electron. (4) (2012)
Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda
inductive power transfer for non-contact wafer-level testing. ISSCC (2011)
Noriyuki Miura, Tsunaaki Shidei, Yuxiang Yuan, Shusuke Kawai, Keita Takatsu, Yuji Kiyota, Yuichi Asano, Tadahiro Kuroda
A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme. IEEE J. Solid State Circuits 46 (4) (2011)