T. Y. Lin

Publication Activity (10 Years)

Years Active: 1988-2012
Publications (10 Years): 0

Top Topics

Bayes Classifier

Detection Method

Simulated Annealing

Top Venues

J. Intell. Manuf.

Publications

Chris Tseng, Nishant Patel, Hrishikesh Paranjape, T. Y. Lin, SooTee Teoh
Classifying twitter data with Naïve Bayes Classifier. GrC (2012)
M. T. Yu, T. Y. Lin, C. Hung
Sequential quadratic programming method with a global search strategy on the cutting-stock problem with rotatable polygons. J. Intell. Manuf. 23 (3) (2012)
Zehua Chen, T. Y. Lin
Matrix Theory for Tolerance Granular Computing. GrC (2010)
Jun Xie, Gaowei Yan, Keming Xie, T. Y. Lin
Neuro-Fuzzy Model-Based CUSUM Method Application in Fault Detection on an Autonomous Vehicle. GrC (2007)
Xinying Xu, Gaowei Yan, Keming Xie, T. Y. Lin
Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot. GrC (2007)
T. Y. Lin
Granular Computing and Web Processing: Representing Documents in Polyhedron. GrC (2007)
Priya Baliga, T. Y. Lin
Kolmogorov complexity based automata modeling for intrusion detection. GrC (2005)
Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin
New encapsulation development for fine pitch IC devices. Microelectron. Reliab. 45 (7-8) (2005)
Churn-Jung Liau, T. Y. Lin
Reasoning about relational granulation in modal logics. GrC (2005)
Wesley W. Chu, T. Y. Lin
Introduction. Appl. Intell. 22 (1) (2005)
T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma
The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectron. Reliab. 44 (4) (2004)
Y. F. Yao, T. Y. Lin, K. H. Chua
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43 (12) (2003)
T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectron. Reliab. 43 (5) (2003)
T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectron. Reliab. 43 (5) (2003)
T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42 (3) (2002)
T. Y. Lin, Vladik Kreinovich
A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. Reliab. Comput. 7 (1) (2001)
T. Y. Lin
Guest Editorial. Intell. Autom. Soft Comput. 2 (2) (1996)
Y. Y. Yao, T. Y. Lin
Generalization of Rough Sets using Modal Logics. Intell. Autom. Soft Comput. 2 (2) (1996)
T. Y. Lin
Anomaly detection: a soft computing approach. NSPW (1994)
T. Y. Lin
Bell and LaPadula axioms: a "new" paradigm for an "old" model. NSPW (1993)
T. Y. Lin
Concurrent automata, database computers, and security: a "new" security paradigm for secure parallel processing. NSPW (1993)
T. Y. Lin
Extensions of pushdown automata and Petri nets. ACM Conference on Computer Science (1989)
T. Y. Lin
Topological data models and approximate retrieval and reasoning. ACM Conference on Computer Science (1989)
T. Y. Lin
Neighborhood systems and relational databases. ACM Conference on Computer Science (1988)