Improving the deflection of wire bonds in stacked chip scale package (CSP).

Y. F. Yao T. Y. Lin K. H. Chua

Published in: Microelectron. Reliab. (2003)

Keyphrases

constraint satisfaction problems
high speed
low cost
constraint satisfaction
scale space
analog vlsi
data sets
neural network
multiscale
optimal solution
search space
scale invariant
high density
tree decomposition
host computer
tree decompositions