K. H. Chua

Publication Activity (10 Years)

Years Active: 2002-2018
Publications (10 Years): 1

Top Topics

Computer Aided Design

Artificial Intelligence

Static Analysis

Top Venues

Publications

A. R. Fadhilah, M. N. Noraini, A. M. Noreliza, K. H. Chua
Analysis on the Employability Skills of UNITEN Graduates in Engineering Program. ICEED (2018)
Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin
New encapsulation development for fine pitch IC devices. Microelectron. Reliab. 45 (7-8) (2005)
T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma
The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectron. Reliab. 44 (4) (2004)
Y. F. Yao, T. Y. Lin, K. H. Chua
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43 (12) (2003)
T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectron. Reliab. 43 (5) (2003)
T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42 (3) (2002)