J. S. Pan

Publication Activity (10 Years)

Years Active: 2002-2003
Publications (10 Years): 0

Publications

T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectron. Reliab. 43 (5) (2003)
T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42 (3) (2002)