Y. F. Yao

Publication Activity (10 Years)

Years Active: 1989-2005
Publications (10 Years): 0

Publications

Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin
New encapsulation development for fine pitch IC devices. Microelectron. Reliab. 45 (7-8) (2005)
Y. F. Yao, T. Y. Lin, K. H. Chua
Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectron. Reliab. 43 (12) (2003)
T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua
Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectron. Reliab. 43 (5) (2003)
T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectron. Reliab. 43 (5) (2003)
Y. F. Yao, B. E. Richards
Parallel CFD Computation on Unstructured Grids. Parallel CFD (1997)
Y. Z. Zhang, T. W. Cole, Y. F. Yao
Optimum removal of LCOs in digital filters. ICASSP (1990)
Y. Z. Zhang, Y. F. Yao
Fast implementation of recursive DFTs. ICASSP (1989)