Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.
T. Y. LinK. L. DavisonW. S. LeongSimon ChuaY. F. YaoJ. S. PanJ. W. ChaiK. C. TohW. C. TjiuPublished in: Microelectron. Reliab. (2003)
Keyphrases
- surface reconstruction
- three dimensional
- shape index
- range images
- range data
- integrated circuit
- object surface
- free form
- space variant
- motion picture
- surface fitting
- smooth surfaces
- shape recovery
- surface model
- software packages
- watershed segmentation
- surface points
- surface geometry
- geometric structure
- segmentation method
- film thickness
- film restoration
- d objects