Login / Signup
Development of the green plastic encapsulation for high density wirebonded leaded packages.
T. Y. Lin
C. M. Fang
Y. F. Yao
K. H. Chua
Published in:
Microelectron. Reliab. (2003)
Keyphrases
</>
high density
low density
close proximity
software engineering
case study
data center
high bandwidth
high power
development process
neural network
magnetic recording
artificial intelligence
neuro fuzzy
information integration
st century