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The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.
T. Y. Lin
W. S. Leong
K. H. Chua
R. Oh
Y. Miao
J. S. Pan
J. W. Chai
Published in:
Microelectron. Reliab. (2002)
Keyphrases
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x ray
digital x ray images
x ray images
medical imaging
tomographic images
segmentation method
intraoperative
electron microscopy
dual energy
pre operative
guide wire
region of interest
ct images
ct scans
ct and mr images