R. Oh

Publication Activity (10 Years)

Years Active: 2002-2002
Publications (10 Years): 0

Publications

T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42 (3) (2002)