Lieve Teugels

Publication Activity (10 Years)

Years Active: 2018-2022
Publications (10 Years): 3

Top Topics

Lessons Learned

Information Integration

Top Venues

VLSI Technology and Circuits

Publications

S. Subhechha, Nouredine Rassoul, Attilio Belmonte, H. Hody, Harold Dekkers, Michiel J. van Setten, Adrian Chasin, Shamin H. Sharifi, S. Sutar, L. Magnarin, Umberto Celano, H. Puliyalil, S. Kundu, M. Pak, Lieve Teugels, D. Tsvetanova, N. Bazzazian, Kevin Vandersmissen, C. Biasotto, D. Batuk, J. Geypen, J. Heijlen, Romain Delhougne, Gouri Sankar Kar
Ultra-low Leakage IGZO-TFTs with Raised Source/Drain for Vt > 0 V and Ion > 30 µA/µm. VLSI Technology and Circuits (2022)
Gaspard Hiblot, Nouredine Rassoul, Lieve Teugels, Katia Devriendt, Adrian Vaisman Chasin, Michiel van Setten, Attilio Belmonte, Romain Delhougne, Gouri Sankar Kar
Process-induced charging damage in IGZO nTFTs. IRPS (2021)
A. Vandooren, Liesbeth Witters, Jacopo Franco, Arindam Mallik, Bertrand Parvais, Z. Wu, Amey Walke, V. Deshpande, E. Rosseel, Andriy Hikavyy, W. Li, L. Peng, Nouredine Rassoul, Geraldine Jamieson, Fumihiro Inoue, G. Verbinnen, Katia Devriendt, Lieve Teugels, N. Heylen, E. Vecchio, T. Zheng, Niamh Waldron, Vincent De Heyn, Dan Mocuta, Nadine Collaert
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling. ICICDT (2018)