Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling.
A. VandoorenLiesbeth WittersJacopo FrancoArindam MallikBertrand ParvaisZ. WuAmey WalkeV. DeshpandeE. RosseelAndriy HikavyyW. LiL. PengNouredine RassoulGeraldine JamiesonFumihiro InoueG. VerbinnenKatia DevriendtLieve TeugelsN. HeylenE. VecchioT. ZhengNiamh WaldronVincent De HeynDan MocutaNadine CollaertPublished in: ICICDT (2018)