Dilip Kumar Maity

Publication Activity (10 Years)

Years Active: 2017-2024
Publications (10 Years): 7

Top Topics

Manufacturing Processes

Automatic Identification

Built In Self Test

Top Venues

J. Electron. Test.

Publications

Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri
Built-in Self-prevention (BISP) for runtime ageing effects of TSVs in 3D ICs. Integr. 94 (2024)
Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri
A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18 (4) (2022)
Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri
TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40 (8) (2021)
Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri
Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing. J. Electron. Test. 35 (5) (2019)
Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri, Hafizur Rahaman
Identification of Faulty TSV with a Built-In Self-Test Mechanism. ATS (2018)
Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri
Identification of Faulty TSVs in 3D IC During Pre-Bond Testing. VLSI Design (2018)
Dilip Kumar Maity, Surajit Kumar Roy, Chandan Giri
Faulty TSVs Identification in 3D IC Using Pre-bond Testing. VDAT (2017)