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Identification of Faulty TSVs in 3D IC During Pre-Bond Testing.

Dilip Kumar MaitySurajit Kumar RoyChandan Giri
Published in: VLSI Design (2018)
Keyphrases
  • integrated circuit
  • hidden markov models
  • fault model
  • database
  • test cases
  • model based diagnosis
  • data mining
  • multi agent
  • special case
  • object oriented
  • person identification