Login / Signup
Identification of Faulty TSVs in 3D IC During Pre-Bond Testing.
Dilip Kumar Maity
Surajit Kumar Roy
Chandan Giri
Published in:
VLSI Design (2018)
Keyphrases
</>
integrated circuit
hidden markov models
fault model
database
test cases
model based diagnosis
data mining
multi agent
special case
object oriented
person identification