Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing.

Dilip Kumar Maity Surajit Kumar Roy Chandan Giri

Published in: J. Electron. Test. (2019)

Keyphrases

integrated circuit
defect detection
test cases
software testing
machine learning
information retrieval
artificial intelligence
data structure
hidden markov models
mobile robot
object oriented
automatic identification
person identification
identification rate
unit testing
software development life cycle