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Faulty TSVs Identification in 3D IC Using Pre-bond Testing.

Dilip Kumar MaitySurajit Kumar RoyChandan Giri
Published in: VDAT (2017)
Keyphrases
  • integrated circuit
  • fault model
  • information technology
  • test set
  • test data
  • automatic identification
  • database
  • data mining
  • decision trees
  • objective function
  • multiple faults