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A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICs.
Dilip Kumar Maity
Surajit Kumar Roy
Chandan Giri
Published in:
ACM J. Emerg. Technol. Comput. Syst. (2022)
Keyphrases
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cost effective
low cost
cost effectiveness
quality control
printed circuit boards
automated visual inspection
data sets
genetic algorithm
defect detection
manufacturing processes
real time
control system
data center
manufacturing process
built in self test