Chetan Prasad

Publication Activity (10 Years)

Years Active: 2014-2023
Publications (10 Years): 5

Top Topics

Cmos Technology

Top Venues

VLSI Technology and Circuits

Publications

M. Jamil, S. Mukhopadhay, M. Ghoneim, A. Shailos, Chetan Prasad, Inanc Meric, Stephen Ramey
Reliability Studies on Advanced FinFET Transistors of the Intel 4 CMOS Technology. IRPS (2023)
Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik, A. Chatterjee, P. C. Chiu, T. Chu, C. Firby, K. Fischer, M. Fradkin, Hannes Greve, A. Gupta, E. Haralson, M. Haran, Jeffery Hicks, A. Illa, M. Jang, S. Klopcic, M. Kobrinsky, B. Kuns, H.-h. Lai, G. Lanni, S.-H. Lee, N. Lindert, C.-l. Lo, Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors, J. Neirynck, P. Packan, A. Paliwal, L. Pantisano, Leif Paulson, Padma Penmatsa, Chetan Prasad, Conor Puls, T. Rahman, R. Ramaswamy, S. Samant, Bernhard Sell, K. Sethi, F. Shah, M. Shamanna, K. Shang, Q. Li, M. Sibakoti, J. Stoeger, N. Strutt, R. Thirugnanasambandam, C. Tsai, X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong, S. Natarajan
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. VLSI Technology and Circuits (2023)
B. Sell, S. An, J. Armstrong, D. Bahr, B. Bains, R. Bambery, K. Bang, D. Basu, S. Bendapudi, D. Bergstrom, R. Bhandavat, S. Bhowmick, M. Buehler, D. Caselli, S. Cekli, Vrsk. Chaganti, Y. J. Chang, K. Chikkadi, T. Chu, T. Crimmins, G. Darby, C. Ege, P. Elfick, T. Elko-Hansen, S. Fang, C. Gaddam, M. Ghoneim, H. Gomez, S. Govindaraju, Z. Guo, Walid M. Hafez, M. Haran, M. Hattendorf, S. Hu, A. Jain, S. Jaloviar, M. Jang, J. Kameswaran, V. Kapinus, A. Kennedy, S. Klopcic, D. Krishnan, J. Leib, Y.-T. Lin, N. Lindert, G. Liu, O. Loh, Y. Luo, S. Mani, M. Mleczko, S. Mocherla, P. Packan, M. Paik, A. Paliwal, R. Pandey, K. Patankar, L. Pipes, P. Plekhanov, Chetan Prasad, M. Prince, G. Ramalingam, R. Ramaswamy, J. Riley, J. R. Sanchez Perez, J. Sandford, A. Sathe, F. Shah, H. Shim, S. Subramanian, S. Tandon, M. Tanniru, D. Thakurta, T. Troeger, X. Wang, C. Ward, A. Welsh, S. Wickramaratne, J. Wnuk, S. Q. Xu, P. Yashar, J. Yaung, K. Yoon, N. Young
Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing. VLSI Technology and Circuits (2022)
Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso
Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. IRPS (2020)
Stephen M. Ramey, Chetan Prasad, A. Rahman
Technology scaling implications for BTI reliability. Microelectron. Reliab. 82 (2018)
Chia-Hong Jan, F. Al-amoody, H.-Y. Chang, T. Chang, Y.-W. Chen, N. Dias, Walid M. Hafez, Doug B. Ingerly, M. Jang, Eric Karl, S. K.-Y. Shi, K. Komeyli, H. Kilambi, A. Kumar, K. Byon, C.-G. Lee, J. Lee, T. Leo, P.-C. Liu, N. Nidhi, R. Olac-vaw, C. Petersburg, K. Phoa, Chetan Prasad, C. Quincy, R. Ramaswamy, T. Rana, L. Rockford, Aravinth Subramaniam, C. Tsai, Peter Vandervoorn, L. Yang, A. Zainuddin, Peng Bai
SRAM cells, optimized for low power, high performance and high density SoC products. VLSIC (2015)
Chetan Prasad
Advanced CMOS reliability challenges. VLSI-DAT (2014)