Cheyun Lin

Publication Activity (10 Years)

Years Active: 2020-2023
Publications (10 Years): 4

Top Topics

Top Venues

Publications

Rahim Kasim, Cheyun Lin, Christopher Perini, James Palmer, N. Gilda, S. Imam, Justin R. Weber, C. Wallace, Jeffery Hicks
Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes. IRPS (2023)
James Palmer, Galor Zhang, Justin R. Weber, Cheyun Lin, Christopher Perini, Rahim Kasim
Intrinsic Reliability of BEOL interlayer dielectric. IRPS (2021)
Cheyun Lin, Uygar E. Avci, M. A. Blount, Rohit Grover, Jeffery Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth
Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process. IRPS (2020)
Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso
Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. IRPS (2020)