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Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.

Chetan PrasadSunny ChughHannes GreveI-chen HoEnamul KabirCheyun LinMahjabin MaksudSteven R. NovakBenjamin OrrKeun Woo ParkAnthony SchmitzZhizheng ZhangPeng BaiDoug B. IngerlyEmre ArmaganHsinwei WuPatrick N. StoverLance HibbelerMichael O'DayDaniel Pantuso
Published in: IRPS (2020)
Keyphrases
  • predicate logic
  • classical logic
  • low cost
  • logic programming
  • databases
  • modal logic
  • multi valued
  • database
  • neural network
  • cost effective
  • key technologies
  • logical framework