Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing.
Walid M. HafezP. AgnihotriM. AsoroM. AykolB. BainsR. BamberyM. BapnaA. BarikA. ChatterjeeP. C. ChiuT. ChuC. FirbyK. FischerM. FradkinHannes GreveA. GuptaE. HaralsonM. HaranJeffery HicksA. IllaM. JangS. KlopcicM. KobrinskyB. KunsH.-h. LaiG. LanniS.-H. LeeN. LindertC.-l. LoY. LuoG. MalyavanathamB. MarinkovicY. MaymonM. NaborsJ. NeirynckP. PackanA. PaliwalL. PantisanoLeif PaulsonPadma PenmatsaChetan PrasadConor PulsT. RahmanR. RamaswamyS. SamantBernhard SellK. SethiF. ShahM. ShamannaK. ShangQ. LiM. SibakotiJ. StoegerN. StruttR. ThirugnanasambandamC. TsaiX. WangA. WangS.-j. WuQ. XuX.-h. ZhongS. NatarajanPublished in: VLSI Technology and Circuits (2023)
Keyphrases
- high density
- high performance computing
- computational science
- high power
- computer architecture
- computing technologies
- scientific computing
- low density
- massively parallel
- computing infrastructure
- grid computing
- high bandwidth
- fault tolerance
- computing systems
- data center
- power consumption
- thin film
- energy efficiency
- parallel computing
- magnetic tape
- data processing
- case study
- distributed computing
- field effect transistors
- computing resources
- real time
- cloud computing
- computer systems
- information systems
- virtual machine
- computing environments
- cost effective
- load balancing
- peer to peer
- sensor networks
- management system
- data analysis