Can Ni

Publication Activity (10 Years)

Years Active: 2017-2024
Publications (10 Years): 8

Top Topics

Dynamic Random Access Memory

Energy Efficient

Top Venues

IEEE J. Solid State Circuits

VLSI Technology and Circuits

Publications

Can Ni, Chuanling Zhao, Hao Liu
Analyzing the Correlation and Risk-Return Trade-off: An Application of the GED-GARCH Model to China's Convertible Bond and Stock Markets. DSAI (2024)
Shanshan Xie, Can Ni, Aseem Sayal, Pulkit Jain, Fatih Hamzaoglu, Jaydeep P. Kulkarni
eDRAM-CIM: Reconfigurable Charge Domain Compute-In-Memory Design With Embedded Dynamic Random Access Memory Array Realizing Adaptive Data Converters. IEEE J. Solid State Circuits 59 (6) (2024)
Rishabh Sehgal, Rishab Mehra, Can Ni, Jaydeep P. Kulkarni
Compute-MLROM: Compute-in-Multi Level Read Only Memory for Energy Efficient Edge AI Inference Engines. ESSCIRC (2023)
Rishabh Sehgal, Tanmay Thareja, Shanshan Xie, Can Ni, Jaydeep P. Kulkarni
A Bit-Serial, Compute-in-SRAM Design Featuring Hybrid-Integrating ADCs and Input Dependent Binary Scaled Precharge Eliminating DACs for Energy-Efficient DNN Inference. IEEE J. Solid State Circuits 58 (7) (2023)
Shanshan Xie, Siddhartha Raman Sundara Raman, Can Ni, Meizhi Wang, Mengtian Yang, Jaydeep P. Kulkarni
Ising-CIM: A Reconfigurable and Scalable Compute Within Memory Analog Ising Accelerator for Solving Combinatorial Optimization Problems. IEEE J. Solid State Circuits 57 (11) (2022)
Shanshan Xie, Can Ni, Pulkit Jain, Fatih Hamzaoglu, Jaydeep P. Kulkarni
Gain-Cell CIM: Leakage and Bitline Swing Aware 2T1C Gain-Cell eDRAM Compute in Memory Design with Bitline Precharge DACs and Compact Schmitt Trigger ADCs. VLSI Technology and Circuits (2022)
Shanshan Xie, Can Ni, Aseem Sayal, Pulkit Jain, Fatih Hamzaoglu, Jaydeep P. Kulkarni
16.2 eDRAM-CIM: Compute-In-Memory Design with Reconfigurable Embedded-Dynamic-Memory Array Realizing Adaptive Data Converters and Charge-Domain Computing. ISSCC (2021)
Aurangozeb, A. K. M. Delwar Hossain, Can Ni, Quazi Sharar, Masum Hossain
Time-Domain Arithmetic Logic Unit With Built-In Interconnect. IEEE Trans. Very Large Scale Integr. Syst. 25 (10) (2017)