Brent Goplen

Publication Activity (10 Years)

Years Active: 2003-2007
Publications (10 Years): 0

Publications

Brent Goplen, Sachin S. Sapatnekar
Placement of 3D ICs with Thermal and Interlayer Via Considerations. DAC (2007)
Brent Goplen, Sachin S. Sapatnekar
Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25 (4) (2006)
Jeng-Liang Tsai, Charlie Chung-Ping Chen, Guoqiang Chen, Brent Goplen, Haifeng Qian, Yong Zhan, Sung-Mo Kang, Martin D. F. Wong, Sachin S. Sapatnekar
Temperature-Aware Placement for SOCs. Proc. IEEE 94 (8) (2006)
Yong Zhan, Brent Goplen, Sachin S. Sapatnekar
Electrothermal analysis and optimization techniques for nanoscale integrated circuits. ASP-DAC (2006)
Brent Goplen, Prashant Saxena, Sachin S. Sapatnekar
Net weighting to reduce repeater counts during placement. DAC (2005)
Brent Goplen, Sachin S. Sapatnekar
Thermal via placement in 3D ICs. ISPD (2005)
Cristinel Ababei, Yan Feng, Brent Goplen, Hushrav Mogal, Tianpei Zhang, Kia Bazargan, Sachin S. Sapatnekar
Placement and Routing in 3D Integrated Circuits. IEEE Des. Test Comput. 22 (6) (2005)
Brent Goplen, Sachin S. Sapatnekar
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach. ICCAD (2003)