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Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives.
Brent Goplen
Sachin S. Sapatnekar
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2006)
Keyphrases
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infrared
power plant
air temperature
visible spectrum
thermal imaging
high temperature
thermal images
multiple objectives
thermal conductivity
finite element analysis
data sets
integrity constraints
multi objective
multiresolution
artificial neural networks
learning environment
social networks
machine learning