Anodic bonding of glass and silicon wafers with an intermediate silicon nitride film and its application to batch fabrication of SPM tip arrays.
Gen-Wen HsiehChing-Hsiang TsaiWei-Chih LinPublished in: Microelectron. J. (2005)
Keyphrases
- integrated circuit
- high density
- thin film
- silicon dioxide
- electrical properties
- plasma etching
- electron beam
- space charge
- film thickness
- semiconductor devices
- magnetic recording
- silicon nitride
- high speed
- chemical vapor deposition
- bag of words
- semiconductor manufacturing
- high temperature
- gate dielectrics
- low density
- x ray
- metal oxide semiconductor
- silicon on insulator
- image classification
- low cost
- computer vision
- real time
- batch processing
- bag of features
- wafer fabrication
- motion picture