Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips.

Tobias Hoose M. Billah Matthias Blaicher P. Marin Philipp-Immanuel Dietrich A. Hofmann Ute Troppenz Martin Möhrle Nicole Lindenmann M. Thiel P. Simon J. Hoffmann M. L. Goedecke Wolfgang Freude Christian Koos

Published in: OFC (2016)