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Martin Möhrle
ORCID
Publication Activity (10 Years)
Years Active: 2013-2023
Publications (10 Years): 8
Top Topics
Si Sio
Low Power
Wire Bonding
Laser Rangefinder
Top Venues
OFC
ECOC
OFC/NFOEC
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Publications
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Tobias Beckerwerth
,
Christoph Kottke
,
Volker Jungnickel
,
Ute Tropenz
,
Martin Möhrle
,
Patrick Runge
,
Martin Schell
56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes.
OFC
(2023)
Yilin Xu
,
Pascal Maier
,
Matthias Blaicher
,
Philipp-Immanuel Dietrich
,
Pablo Marin-Palomo
,
Wladislaw Hartmann
,
Muhammad Rodlin Billah
,
Ute Troppenz
,
Martin Möhrle
,
Sebastian Randel
,
Wolfgang Freude
,
Christian Koos
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements.
OFC
(2020)
Moritz Baier
,
Francisco M. Soares
,
Tom Gaertner
,
A. Schoenau
,
Martin Möhrle
,
Martin Schell
New Polarization Multiplexed Externally Modulated Laser PIC.
ECOC
(2018)
Muhammad Rodlin Billah
,
Juned N. Kemal
,
Pablo Marin-Palomo
,
Matthias Blaicher
,
Yasar Kutuvantavida
,
Clemens Kieninger
,
Heiner Zwickel
,
Philipp-Immanuel Dietrich
,
Stefan Wolf
,
Tobias Hoose
,
Y. Xu
,
Ute Troppenz
,
Martin Möhrle
,
Sebastian Randel
,
Wolfgang Freude
,
Christian Koos
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators.
ECOC
(2017)
Jung Han Choi
,
Marko Gruner
,
Heinz-Gunter Bach
,
Michael Theurer
,
Ute Troppenz
,
Martin Möhrle
,
Martin Schell
Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers.
OFC
(2017)
Muhammad Rodlin Billah
,
Matthias Blaicher
,
Juned N. Kemal
,
Tobias Hoose
,
Heiner Zwickel
,
Philipp-Immanuel Dietrich
,
Ute Troppenz
,
Martin Möhrle
,
Florian Merget
,
A. Hofmann
,
Jeremy Witzens
,
Sebastian Randel
,
Wolfgang Freude
,
Christian Koos
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding.
OFC
(2017)
Tobias Hoose
,
M. Billah
,
Matthias Blaicher
,
P. Marin
,
Philipp-Immanuel Dietrich
,
A. Hofmann
,
Ute Troppenz
,
Martin Möhrle
,
Nicole Lindenmann
,
M. Thiel
,
P. Simon
,
J. Hoffmann
,
M. L. Goedecke
,
Wolfgang Freude
,
Christian Koos
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips.
OFC
(2016)
Norbert Keil
,
David de Felipe
,
Ziyang Zhang
,
Moritz Kleinert
,
Crispin Zawadzki
,
Walter Brinker
,
Andrzej Polatynski
,
Gelani Irmscher
,
Martin Möhrle
,
Heinz-Gunter Bach
,
Martin Schell
Novel integration technologies for disruptive capacity upgrade in data center systems.
OFC
(2016)
Laurent Schares
,
Russell A. Budd
,
Daniel M. Kuchta
,
Fuad E. Doany
,
Clint Schow
,
Martin Möhrle
,
Ariane Sigmund
,
W. Rehbein
Etched-facet semiconductor optical amplifiers for gain-integrated photonic switch fabrics.
ECOC
(2015)
Norbert Keil
,
Crispin Zawadzki
,
Ziyang Zhang
,
David de Felipe
,
Alejandro Maese-Novo
,
Walter Brinker
,
Holger Klein
,
Christoph Wagner
,
Francisco M. Soares
,
Martin Möhrle
,
Norbert Grote
Progress in polymer-based components for next-generation PON applications.
OFC/NFOEC
(2013)
Martin Schell
,
Heinz-Gunter Bach
,
Klemens Janiak
,
Norbert Keil
,
Martin Möhrle
,
Patrick Runge
,
Ziyang Zhang
Coherent receiver photonic integrated circuits.
OFC/NFOEC
(2013)