Matthias Blaicher

Publication Activity (10 Years)

Years Active: 2016-2022
Publications (10 Years): 10

Top Topics

Physical Characteristics

Integrated Circuit

Top Venues

Publications

Pascal Maier, Yilin Xu, Matthias Lauermann, Alexandra Henniger-Ludwig, Hermann Kapim, Mareike Trappen, Torben Kind, Achim Weber, Matthias Blaicher, Philipp-Immanuel Dietrich, Clemens Wurster, Sebastian Randel, Wolfgang Freude, Christian Koos
3D-Printed Optical Elements for Coupling of VCSEL and Photodiode Arrays to Multi-Core Fibers in an SFP Transceiver Assembly. OFC (2022)
Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Muhammad Rodlin Billah, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. OFC (2020)
Aleksandar Nesic, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos
Hybrid 2D/3D photonic integration for non-planar circuit topologies. CoRR (2019)
Christian Koos, Wolfgang Freude, Sebastian Randel, Philipp-Immanuel Dietrich, Matthias Blaicher, Y. Xu, Muhammad Rodlin Billah, Tobias Hoose, Mareike Trappen, A. Hofmann
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics. ICTON (2018)
Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, Christian Koos
3D-Printed Optics for Wafer-Scale Probing. ECOC (2018)
Tobias Hoose, Matthias Blaicher, Juned N. Kemal, Heiner Zwickel, Muhammad Rodlin Billah, Philipp-Immanuel Dietrich, A. Hofmann, Wolfgang Freude, Sebastian Randel, Christian Koos
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting. ECOC (2018)
Christian Koos, Wolfgang Freude, Sebastian Randel, Muhammad Rodlin Billah, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Juned N. Kemal, Aleksandar Nesic, Andreas Hofmann
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production. ECOC (2018)
Muhammad Rodlin Billah, Juned N. Kemal, Pablo Marin-Palomo, Matthias Blaicher, Yasar Kutuvantavida, Clemens Kieninger, Heiner Zwickel, Philipp-Immanuel Dietrich, Stefan Wolf, Tobias Hoose, Y. Xu, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. ECOC (2017)
Muhammad Rodlin Billah, Matthias Blaicher, Juned N. Kemal, Tobias Hoose, Heiner Zwickel, Philipp-Immanuel Dietrich, Ute Troppenz, Martin Möhrle, Florian Merget, A. Hofmann, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. OFC (2017)
Tobias Hoose, M. Billah, Matthias Blaicher, P. Marin, Philipp-Immanuel Dietrich, A. Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, J. Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. OFC (2016)