Muhammad Rodlin Billah

Publication Activity (10 Years)

Years Active: 2017-2020
Publications (10 Years): 7

Top Topics

Physical Characteristics

Stress Response

Top Venues

Publications

Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Muhammad Rodlin Billah, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. OFC (2020)
Christian Koos, Wolfgang Freude, Sebastian Randel, Philipp-Immanuel Dietrich, Matthias Blaicher, Y. Xu, Muhammad Rodlin Billah, Tobias Hoose, Mareike Trappen, A. Hofmann
Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics. ICTON (2018)
Mareike Trappen, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Muhammad Rodlin Billah, Wolfgang Freude, Christian Koos
3D-Printed Optics for Wafer-Scale Probing. ECOC (2018)
Tobias Hoose, Matthias Blaicher, Juned N. Kemal, Heiner Zwickel, Muhammad Rodlin Billah, Philipp-Immanuel Dietrich, A. Hofmann, Wolfgang Freude, Sebastian Randel, Christian Koos
Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting. ECOC (2018)
Christian Koos, Wolfgang Freude, Sebastian Randel, Muhammad Rodlin Billah, Matthias Blaicher, Philipp-Immanuel Dietrich, Tobias Hoose, Yilin Xu, Juned N. Kemal, Aleksandar Nesic, Andreas Hofmann
Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production. ECOC (2018)
Muhammad Rodlin Billah, Juned N. Kemal, Pablo Marin-Palomo, Matthias Blaicher, Yasar Kutuvantavida, Clemens Kieninger, Heiner Zwickel, Philipp-Immanuel Dietrich, Stefan Wolf, Tobias Hoose, Y. Xu, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. ECOC (2017)
Muhammad Rodlin Billah, Matthias Blaicher, Juned N. Kemal, Tobias Hoose, Heiner Zwickel, Philipp-Immanuel Dietrich, Ute Troppenz, Martin Möhrle, Florian Merget, A. Hofmann, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. OFC (2017)