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Ute Troppenz
Publication Activity (10 Years)
Years Active: 2016-2023
Publications (10 Years): 9
Top Topics
Wire Bonding
Low Power
Physical Characteristics
Laser Radar
Top Venues
OFC
ECOC
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Publications
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Michael Theurer
,
Christoph Kottke
,
Ronald Freund
,
Felix Ganzer
,
Patrick Runge
,
Martin Moehrle
,
Ute Troppenz
,
Ariane Sigmund
,
Martin Schell
4 x 200 Gb/s EML-Array with a Single MQW Layer Stack.
OFC
(2023)
Ute Troppenz
,
Michael Theurer
,
Martin Moehrle
,
Ariane Sigmund
,
Marko Gruner
,
Martin Schell
Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays.
OFC
(2022)
Yilin Xu
,
Pascal Maier
,
Matthias Blaicher
,
Philipp-Immanuel Dietrich
,
Pablo Marin-Palomo
,
Wladislaw Hartmann
,
Muhammad Rodlin Billah
,
Ute Troppenz
,
Martin Möhrle
,
Sebastian Randel
,
Wolfgang Freude
,
Christian Koos
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements.
OFC
(2020)
Muhammad Rodlin Billah
,
Juned N. Kemal
,
Pablo Marin-Palomo
,
Matthias Blaicher
,
Yasar Kutuvantavida
,
Clemens Kieninger
,
Heiner Zwickel
,
Philipp-Immanuel Dietrich
,
Stefan Wolf
,
Tobias Hoose
,
Y. Xu
,
Ute Troppenz
,
Martin Möhrle
,
Sebastian Randel
,
Wolfgang Freude
,
Christian Koos
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators.
ECOC
(2017)
Jung Han Choi
,
Marko Gruner
,
Heinz-Gunter Bach
,
Michael Theurer
,
Ute Troppenz
,
Martin Möhrle
,
Martin Schell
Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers.
OFC
(2017)
Michael Theurer
,
Martin Moehrle
,
Ute Troppenz
,
Heinz-Gunter Bach
,
Ariane Sigmund
,
Georges Przyrembel
,
Martin Schell
4 × 56 Gb/s high output power electroabsorption modulated laser array.
OFC
(2017)
Muhammad Rodlin Billah
,
Matthias Blaicher
,
Juned N. Kemal
,
Tobias Hoose
,
Heiner Zwickel
,
Philipp-Immanuel Dietrich
,
Ute Troppenz
,
Martin Möhrle
,
Florian Merget
,
A. Hofmann
,
Jeremy Witzens
,
Sebastian Randel
,
Wolfgang Freude
,
Christian Koos
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding.
OFC
(2017)
Michael Theurer
,
Yin Wang
,
Li Zeng
,
Ute Troppenz
,
Georges Przyrembel
,
Ariane Sigmund
,
Martin Moehrle
,
Martin Schell
2 × 56 GB/s from a double side electroabsorption modulated DFB laser.
OFC
(2016)
Tobias Hoose
,
M. Billah
,
Matthias Blaicher
,
P. Marin
,
Philipp-Immanuel Dietrich
,
A. Hofmann
,
Ute Troppenz
,
Martin Möhrle
,
Nicole Lindenmann
,
M. Thiel
,
P. Simon
,
J. Hoffmann
,
M. L. Goedecke
,
Wolfgang Freude
,
Christian Koos
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips.
OFC
(2016)