Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits.
Benjamin BackesColin McDonoughLarry SmithWei WangRobert E. GeerPublished in: J. Electron. Test. (2012)
Keyphrases
- integrated circuit
- semiconductor devices
- electron beam
- printed circuit boards
- high density
- metal oxide semiconductor
- thin film
- magnetic recording
- field effect transistors
- low cost
- chemical vapor deposition
- high speed
- steady state
- plasma etching
- design parameters
- biologically inspired
- neural network model
- silicon dioxide
- computer simulation
- artificial neural networks