Larry Smith

Publication Activity (10 Years)

Years Active: 2009-2012
Publications (10 Years): 0

Top Topics

Integrated Circuit

Silicon Dioxide

Top Venues

J. Electron. Test.

Publications

Benjamin Backes, Colin McDonough, Larry Smith, Wei Wang, Robert E. Geer
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. J. Electron. Test. 28 (1) (2012)
Sherief Reda, Gregory Smith, Larry Smith
Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration. IEEE Trans. Very Large Scale Integr. Syst. 17 (9) (2009)