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Benjamin Backes
Publication Activity (10 Years)
Years Active: 2012-2012
Publications (10 Years): 0
Top Topics
Integrated Circuit
Silicon Dioxide
High Density
Plasma Etching
Top Venues
J. Electron. Test.
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Publications
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Benjamin Backes
,
Colin McDonough
,
Larry Smith
,
Wei Wang
,
Robert E. Geer
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits.
J. Electron. Test.
28 (1) (2012)