Maximizing the Functional Yield of Wafer-to-Wafer 3-D Integration.

Sherief Reda Gregory Smith Larry Smith

Published in: IEEE Trans. Very Large Scale Integr. Syst. (2009)

Keyphrases

semiconductor manufacturing
integrated circuit
massively parallel
real time
information retrieval
learning environment
neural network
high level
wide range
control system
data integration
wafer fabrication