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Wei-Chih Cheng
Publication Activity (10 Years)
Years Active: 2012-2023
Publications (10 Years): 6
Top Topics
Average Error
Euclidean Reconstruction
Autocalibration
Camera Calibration
Top Venues
ASICON
OFC
IEEE Trans. Vis. Comput. Graph.
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Publications
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Kai-Chieh Chang
,
Chia-Ling Tsai
,
Wei-Chih Cheng
,
Zon
,
Chun-Nien Liu
,
Tien-Tsorng Shih
,
Sheng-Lung Huang
,
Charles W. Tu
,
Wood-Hi Cheng
Record Gain of 18-dB for Broadband Single-Model Cr-Doped Crystalline Core Fiber by Small Core Diameter.
OFC
(2023)
Yang Jiang
,
Fangzhou Du
,
Zepeng Qiao
,
Wei-Chih Cheng
,
Jiaqi He
,
Xinyi Tang
,
Feifei Liu
,
Lei Wen
,
Qing Wang
,
Hongyu Yu
InAlN/GaN HEMTs on Si with 0.18-Ω•mm Contact Resistance and 2.1-A/mm Drain Current Density.
ASICON
(2021)
Chiu-Ming Liu
,
Jhuo-Wei Li
,
Chun-Nien Liu
,
Wei-Chih Cheng
,
Charles Tu
,
Tien-Tsorng Shih
,
Sheng-Lung Huang
,
Wood-Hi Cheng
Tetrahedral-Cr Enhancement Employing Dielectric Coating for Higher Gain of Broadband Cr-Doped Fiber Amplifiers.
OFC
(2020)
Jingyi Wu
,
Hongyu Yu
,
Yang Jiang
,
Zeyu Wan
,
Siqi Lei
,
Wei-Chih Cheng
,
Guangnan Zhou
,
Robert Sokolovskij
,
Qing Wang
,
Guangrui Maggie Xia
Oxygen-plasma-based digital etching for GaN/AlGaN high electron mobility transistors.
ASICON
(2019)
Huashu Wang
,
Wei Ma
,
Zhiming Xiao
,
Wei-Chih Cheng
,
Liang Wang
,
Fanming Zeng
,
Hongyu Yu
,
Weibo Hu
The Design and Performance Comparison of Wide Bandwidth LNA with Three Different Kinds of Technologies.
ASICON
(2019)
Pei-Chih Wen
,
Wei-Chih Cheng
,
Yu-Shuen Wang
,
Hung-Kuo Chu
,
Nick C. Tang
,
Hong-Yuan Mark Liao
Court Reconstruction for Camera Calibration in Broadcast Basketball Videos.
IEEE Trans. Vis. Comput. Graph.
22 (5) (2016)
Chien-Jian Tseng
,
Hung-Wei Chen
,
Wei-Ting Shen
,
Wei-Chih Cheng
,
Hsin-Shu Chen
A 10-b 320-MS/s Stage-Gain-Error Self-Calibration Pipeline ADC.
IEEE J. Solid State Circuits
47 (6) (2012)
Jau-Sheng Wang
,
Chun-Chin Tsai
,
Jyun-Sian Liou
,
Wei-Chih Cheng
,
Shun-Yuan Huang
,
Gi-Hung Chang
,
Wood-Hi Cheng
Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests.
Microelectron. Reliab.
52 (5) (2012)