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Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests.
Jau-Sheng Wang
Chun-Chin Tsai
Jyun-Sian Liou
Wei-Chih Cheng
Shun-Yuan Huang
Gi-Hung Chang
Wood-Hi Cheng
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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composite materials
thermal conductivity
infrared
learning materials
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software package
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thermal images
post hoc