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Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests.

Jau-Sheng WangChun-Chin TsaiJyun-Sian LiouWei-Chih ChengShun-Yuan HuangGi-Hung ChangWood-Hi Cheng
Published in: Microelectron. Reliab. (2012)
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