T. Ishizaki

Publication Activity (10 Years)

Years Active: 2011-2017
Publications (10 Years): 2

Top Topics

Power Electronics

High Temperature

Thermal Imaging

Electron Microscopy

Top Venues

Microelectron. Reliab.

Publications

T. Ishizaki, D. Miura, A. Kuno, K. Hasegawa, Masanori Usui, Y. Yamada
Young's modulus of a sintered Cu joint and its influence on thermal stress. Microelectron. Reliab. (2017)
T. Ishizaki, D. Miura, A. Kuno, R. Nagao, S. Aoki, Y. Ohshima, T. Kino, Masanori Usui, Y. Yamada
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. Microelectron. Reliab. 64 (2016)
T. Ishizaki, Masanori Usui, Y. Yamada
Thermal cycle reliability of Cu-nanoparticle joint. Microelectron. Reliab. 55 (9-10) (2015)
T. Ishizaki, M. Yanase, A. Kuno, T. Satoh, Masanori Usui, F. Osawa, Y. Yamada
Thermal simulation of joints with high thermal conductivities for power electronic devices. Microelectron. Reliab. 55 (7) (2015)
T. Ishizaki, A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh, Y. Yamada
Reliability of Cu nanoparticle joint for high temperature power electronics. Microelectron. Reliab. 54 (9-10) (2014)
T. Ishizaki, T. Satoh, A. Kuno, A. Tane, M. Yanase, F. Osawa, Y. Yamada
Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. Microelectron. Reliab. 53 (9-11) (2013)
Hiraku Okada, T. Ishizaki, Takaya Yamazato, Tomohiro Yendo, Toshiaki Fujii
Erasure coding for road-to-vehicle visible light communication systems. CCNC (2011)