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D. Miura
Publication Activity (10 Years)
Years Active: 2016-2017
Publications (10 Years): 3
Top Topics
Thermal Conductivity
Linear Prediction
Power Consumption
Wavelet Packet
Top Venues
Microelectron. Reliab.
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Publications
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T. Ishizaki
,
D. Miura
,
A. Kuno
,
K. Hasegawa
,
Masanori Usui
,
Y. Yamada
Young's modulus of a sintered Cu joint and its influence on thermal stress.
Microelectron. Reliab.
(2017)
Y. Yamada
,
M. Yanase
,
D. Miura
,
K. Chikuba
Novel heatsink for power semiconductor module using high thermal conductivity graphite.
Microelectron. Reliab.
64 (2016)
T. Ishizaki
,
D. Miura
,
A. Kuno
,
R. Nagao
,
S. Aoki
,
Y. Ohshima
,
T. Kino
,
Masanori Usui
,
Y. Yamada
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion.
Microelectron. Reliab.
64 (2016)