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Thermal characterizations of Cu nanoparticle joints for power semiconductor devices.
T. Ishizaki
T. Satoh
A. Kuno
A. Tane
M. Yanase
F. Osawa
Y. Yamada
Published in:
Microelectron. Reliab. (2013)
Keyphrases
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semiconductor devices
power consumption
electron beam
human body
acyclic database schemes
human motion
search algorithm
low cost
steady state
electron microscopy
mechanical properties
high temperature