Thermal simulation of joints with high thermal conductivities for power electronic devices.
T. IshizakiM. YanaseA. KunoT. SatohMasanori UsuiF. OsawaY. YamadaPublished in: Microelectron. Reliab. (2015)
Keyphrases
- electronic devices
- infrared
- electrical power
- wide range
- neural network
- visible spectrum
- computer vision
- power consumption
- thermal imaging
- high precision
- simulation model
- finite element analysis
- solder ball connect
- injection lasers
- thermal images
- heat transfer
- simulation models
- simulation environment
- degrees of freedom
- numerical simulations
- multi agent systems