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Thermal cycle reliability of Cu-nanoparticle joint.

T. IshizakiMasanori UsuiY. Yamada
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • infrared
  • artificial intelligence
  • information systems
  • joint optimization
  • highly reliable
  • real time
  • machine learning
  • image processing
  • data structure
  • electron microscopy
  • thermal images