Philip Jacob

Publication Activity (10 Years)

Years Active: 1991-2015
Publications (10 Years): 1

Top Venues

IEEE Access

Kaiserslautern University of Technology, Germany (PHD)

Education History

Kaiserslautern University of Technology, Germany

PHD

Publications

Ryan Clarke, Philip Jacob, Okan Erdogan, Paul Belemijian, Srikumar Raman, Mitchell R. LeRoy, Tuhin Guha Neogi, Russell P. Kraft, Diana-Andra Borca-Tasciuc, John F. McDonald
Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU. IEEE Access 3 (2015)
Alexey Gutin, Philip Jacob, Michael Chu, Paul M. Belemjian, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald
Carry Chains for Ultra High-Speed SiGe HBT Adders. IEEE Trans. Circuits Syst. I Regul. Pap. (9) (2011)
Jin Woo Kim, Michael Chu, Philip Jacob, Aamir Zia, Russell P. Kraft, John F. McDonald
Reconfigurable 40 GHz BiCMOS uniform delay crossbar switch for broadband and wide tuning range narrowband applications. IET Circuits Devices Syst. 5 (3) (2011)
Michael Chu, Philip Jacob, Jin Woo Kim, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald
A 40 Gs/s Time Interleaved ADC Using SiGe BiCMOS Technology. IEEE J. Solid State Circuits 45 (2) (2010)
Michael Chu, Philip Jacob, Jin Woo Kim, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald
Correction to "A 40 GS/s Time Interleaved ADC Using SiGe BiCMOS Technology". IEEE J. Solid State Circuits 45 (10) (2010)
Aamir Zia, Philip Jacob, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald
A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration. IEEE Trans. Very Large Scale Integr. Syst. 18 (6) (2010)
John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. 3DIC (2009)
Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald, Kerry Bernstein
Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks. Proc. IEEE 97 (1) (2009)
Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald
Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. ICCD (2007)
Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald
Predicting the Performance of a 3D Processor-Memory Chip Stack. IEEE Des. Test Comput. 22 (6) (2005)
Philip Jacob, Bruce Davie
Technical challenges in the delivery of interprovider QoS. IEEE Commun. Mag. 43 (6) (2005)
Andreas Disch, Philip Jacob, Michael Münchhofen
Viper - A 3D-Modeling and Visualization Toolkit for Web-Based Applications. Comput. Networks 30 (1-7) (1998)
Philip Jacob, Andrew D. Ball
Empirical Validation of the Performance of a Class of Transient Detector. Evolutionary Computing, AISB Workshop (1997)
Philip Jacob
An Improved Shading Algorithm for Radiosity Based Renderers. Focus on Scientific Visualization (1991)

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Publication Activity (10 Years)

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Philip Jacob