Aamir Zia

Publication Activity (10 Years)

Years Active: 2005-2014
Publications (10 Years): 0

Top Topics

Live Cell Imaging

Top Venues

IET Circuits Devices Syst.

Publications

Xuelian Liu, Mitchell R. LeRoy, Ryan Clarke, Michael Chu, H. O. Aquino, Srikumar Raman, Aamir Zia, Russell P. Kraft, John F. McDonald
Design of BiCMOS SRAMs for high-speed SiGe applications. IET Circuits Devices Syst. 8 (6) (2014)
Xuelian Liu, Aamir Zia, Mitchell R. LeRoy, Srikumar Raman, Ryan Clarke, Russell P. Kraft, John F. McDonald
A three-dimensional DRAM using floating body cell in FDSOI devices. DDECS (2012)
Aamir Zia, Sachhidh Kannan, H. Jonathan Chao, Garrett S. Rose
3D NOC for many-core processors. Microelectron. J. 42 (12) (2011)
Jin Woo Kim, Michael Chu, Philip Jacob, Aamir Zia, Russell P. Kraft, John F. McDonald
Reconfigurable 40 GHz BiCMOS uniform delay crossbar switch for broadband and wide tuning range narrowband applications. IET Circuits Devices Syst. 5 (3) (2011)
Aamir Zia, Philip Jacob, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald
A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration. IEEE Trans. Very Large Scale Integr. Syst. 18 (6) (2010)
John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. 3DIC (2009)
Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald, Kerry Bernstein
Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks. Proc. IEEE 97 (1) (2009)
Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald
Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. ICCD (2007)
Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald
Predicting the Performance of a 3D Processor-Memory Chip Stack. IEEE Des. Test Comput. 22 (6) (2005)