Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.
John F. McDonaldOkan ErdoganPhilip JacobPaul M. BelemjianAlexey GutinAamir ZiaMichael ChuJin Woo KimRyan ClarkeNate DeSimoneSherry LiuRussell P. KraftPublished in: 3DIC (2009)