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Ryan Clarke
Publication Activity (10 Years)
Years Active: 2009-2018
Publications (10 Years): 5
Top Topics
Cmos Technology
Virtual Memory
Middle School Students
Fault Localization
Top Venues
MEMSYS
IEEE Trans. Circuits Syst. II Express Briefs
Proc. IEEE
IET Circuits Devices Syst.
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Publications
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Randall Burnett
,
Ryan Clarke
,
Timothy Lee
,
Harold Hearne
,
Jacob Vogel
,
Quentin Herr
,
Anna Herr
Demonstration of superconducting memory for an RQL CPU.
MEMSYS
(2018)
Ryan Clarke
,
Sarah Judd
Evaluating the Impact of the Girls Who Code Summer Immersion Program: (Abstract Only).
SIGCSE
(2018)
Ryan Clarke
,
Mitchell R. LeRoy
,
Srikumar Raman
,
Tuhin Guha Neogi
,
Russell P. Kraft
,
John F. McDonald
140 Gb/s Serializer Using Clock Doublers in 90 nm SiGe Technology.
IEEE J. Solid State Circuits
50 (11) (2015)
Ryan Clarke
,
Philip Jacob
,
Okan Erdogan
,
Paul Belemijian
,
Srikumar Raman
,
Mitchell R. LeRoy
,
Tuhin Guha Neogi
,
Russell P. Kraft
,
Diana-Andra Borca-Tasciuc
,
John F. McDonald
Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU.
IEEE Access
3 (2015)
Mitchell R. LeRoy
,
Srikumar Raman
,
Michael Chu
,
Jin Woo Kim
,
Jong-Ru Guo
,
Kuan Zhou
,
Chao You
,
Ryan Clarke
,
Bryan S. Goda
,
John F. McDonald
High-Speed Reconfigurable Circuits for Multirate Systems in SiGe HBT Technology.
Proc. IEEE
103 (7) (2015)
Xuelian Liu
,
Srikumar Raman
,
Ryan Clarke
,
Mitchell R. LeRoy
,
Okan Erdogan
,
Michael Chu
,
Alexey Gutin
,
Russell P. Kraft
,
John F. McDonald
Design of High-Speed Register Files Using SiGe HBT BiCMOS Technology.
IEEE Trans. Circuits Syst. II Express Briefs
(3) (2014)
Xuelian Liu
,
Mitchell R. LeRoy
,
Ryan Clarke
,
Michael Chu
,
H. O. Aquino
,
Srikumar Raman
,
Aamir Zia
,
Russell P. Kraft
,
John F. McDonald
Design of BiCMOS SRAMs for high-speed SiGe applications.
IET Circuits Devices Syst.
8 (6) (2014)
Xuelian Liu
,
Aamir Zia
,
Mitchell R. LeRoy
,
Srikumar Raman
,
Ryan Clarke
,
Russell P. Kraft
,
John F. McDonald
A three-dimensional DRAM using floating body cell in FDSOI devices.
DDECS
(2012)
John F. McDonald
,
Okan Erdogan
,
Philip Jacob
,
Paul M. Belemjian
,
Alexey Gutin
,
Aamir Zia
,
Michael Chu
,
Jin Woo Kim
,
Ryan Clarke
,
Nate DeSimone
,
Sherry Liu
,
Russell P. Kraft
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.
3DIC
(2009)