M. Mayer

Publication Activity (10 Years)

Years Active: 1994-2015
Publications (10 Years): 1

Top Topics

Optimization Algorithm

Recognition Process

Ultrasound Images

Top Venues

Microelectron. Reliab.

Publications

J. Gomes, M. Mayer, Bill S. Lin
Development of a fast method for optimization of Au ball bond process. Microelectron. Reliab. 55 (3-4) (2015)
Alireza Rezvani, Aashish Shah, M. Mayer, Y. Zhou, J. T. Moon
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. Microelectron. Reliab. 53 (7) (2013)
Aashish Shah, Alireza Rezvani, M. Mayer, Y. Zhou, John Persic, J. T. Moon
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectron. Reliab. 51 (1) (2011)
I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Y. Zhou
Role of process parameters on bondability and pad damage indicators in copper ball bonding. Microelectron. Reliab. 51 (1) (2011)
A. Pequegnat, H. J. Kim, M. Mayer, Y. Zhou, John Persic, J. T. Moon
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. Microelectron. Reliab. 51 (1) (2011)
M. Mayer, J. T. Moon, John Persic
Measuring stress next to Au ball bond during high temperature aging. Microelectron. Reliab. 49 (7) (2009)
C. J. Hang, C. Q. Wang, M. Mayer, Y. H. Tian, Y. Zhou, H. H. Wang
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron. Reliab. 48 (3) (2008)
Fritz Paschke, Walter Ehrlich-Schupita, M. Mayer
Design of a Brewster-angle broad-band waveguide window with ghost-mode suppression for the Ku-band. Elektrotech. Informationstechnik 125 (5) (2008)
A. Barletta, M. Mayer, B. Moser
Leafing digital content. IUI (2004)
Thomas Norgall, M. Mayer, G. Hergenröder
Übergang zwischen ISO/OSI-Anwendungsprotokollen X.400 und MAP MMS für eine KKS-Laboranbindung. GMDS (1994)